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Description
Product Information:
- iBOND® Etch 35
- iBond® Total Etch is the Etch & Rinse 2-step bonding adhesive.
- Contains 35% Phosphoric Acid
- Due to the innovative nano-filler technology,
- iBond Total Etch attains high bond strength to both enamel
and dentin while ensuring optimal marginal sealing - Clinically proven to provide reliable and consistent bond strength
- Dense adhesive layer and good tag formation: leads to improved marginal sealing
- Only one coat required with no agitation
- Demonstrates reduction in postop sensitivity
- Refrigeration not required
- Company: Kulzer